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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 14 tsz02201-0h3h0b101420-1-2 ? 20 15 rohm co., ltd. all rights reserved. 09.dec.2015 rev.001 tsz22111 ? 14 ? 0 01 www.rohm.com mobile phone module driver parallel interface type lens driver for stepping motor bd 6360gul general description the b d6 360gul is a motor driver with dual, built- in f ull - on type two h-bridges . it also has a power supply function for photo-interrupter to detect motor position and wave-shaping circuit built- in . this small surface mounting package csp is most suitable for mobile system and home appliance. features ? low on-resistance power cmos output ? esd protection: 8k v , human body model (hbm) ? drive mode sw itch function ? control input pins fit the signal of 1.8v system ? voltage-regulator for photo-interrupter and comparator with hysteresis to convert to sharp waveform ? under voltage locked out protection & thermal shut down circuit applications ? mobile system ? home appliance ? amusement system, etc key specifications ? power supply voltage range: 2.3v to 5.5v ? circuit current (no load): 1.1ma(typ) ? stand-by current: 5 a ( max) ? control input voltage range: 0v to v cc v ? h-bridge output current: -0.4a to +0.4a ? output on -resistance (total): 1.0 (typ) ? operating temperature range: - 25 c to +85c package w(typ) x d(typ) x h(max) vcsp50l2 2.10mm x 2.10mm x 0.55 mm typical application circuit vcsp50l2 bypass filter capacitor for power supply input ps vcc 1f to 100f out1a out1b in1a bandgap tsd & uvlo 4d 3d 4b 1d 1c power save level shift & pre driver in1b 2c sel 4c h-bridge full on gnd out 2a out2b 1b 1a 2d h-bridge full on 3b 3c level shift & pre driver cout in2a in2b bias cin logic logic vcc vref 3a 2a 4a vcc comparator output for converting to sharp waveform comparator input for converting to sharp waveform regulator for photo-interrupter - + power-saving h: active l: stand- by motor control input motor control input selectable drive mode h : in/in l : en/in datashee t datashee t downloaded from: http:///
2/ 14 bd6 360gul tsz02201-0h3h0b101420-1-2 ? 20 15 rohm co., ltd. all rights reserved. 09.dec.2015 rev.001 www.rohm.com tsz22111 ? 14 ? 001 pin configuration pin descriptions pin no. pin name funct ion 1a out2b h-bridge output 2b 2a cin comparator input for sharp waveform 3a cout comparator output for sharp waveform 4a bias voltage-regulator for photo-interrupter 1b out2a h-bridge output 2a 2b index post 3b in2a control logic input 2a 4b vcc power supply 1c out1b h-bridge output 1b 2c in1b control logic input 1b 3c in2b control logic input 2b 4c sel drive mode switch function 1d out1a h-bridge output 1a 2d gnd ground 3d in1a control logic input 1a 4d ps power-saving function block diagram 1 2 3 4 a out2b cin cout bias b out2a index post in2a vcc c out1b in1b in2b sel d out1a gnd in1a ps top view out1a out1b gnd out2a out2b ps vcc in1a bandgap tsd & uvlo 4d 3d 4b 1d 1c power save level shift & pre driver in1b 2c sel 4c h-bridge full on 1b 1a 2d h-bridge full on 3b 3c level shift & pre driver cout in2a in2b bias cin logic logic vcc vref 3a 2a 4a vcc + - downloaded from: http:///
3/ 14 bd6 360gul tsz02201-0h3h0b101420-1-2 ? 20 15 rohm co., ltd. all rights reserved. 09.dec.2015 rev.001 www.rohm.com tsz22111 ? 14 ? 001 description of blocks 1. power-saving function a power-saving function is included, which allows the system to save power when not driving the motor. the voltage level on this pin should be set high so as to keep the ope ration mode . (see the electrical characteristics; p.4/ 14) 2. motor control input (a) in1a, in1b, in2a and in2b pin logic level controls the output logic of h-bridge. (see the electrical characteristics; p .4 /1 4, and i/o truth table; p .7 /1 4) (b) sel pin logic level sets the in/in or en/in drive mode. (see the electrical characteristics; p.4 /1 4 and i/o truth table; p.7 /1 4) 3. photo-interrupter regulator the bias pin can output vcc voltage for photo-interrupter during th e operation mode . when connecting photo-interrupter to this pin, pay attention to the on resistance of internal power transistor. (see the typical performance curves ; p .6 /14) absolute maximum ratings (ta=25c) parameter symbol limit unit power supply voltage v cc -0.3 to +6.5 v control input voltage v in -0.3 t o +v cc +0.3 v power dissipation pd 0. 73 (note 1) w h-bridge output current i out -0.5 to +0.5 (note 2) a/ch storage temperature range tstg -55 to +150 c junction temperature tjmax 150 c (note 1) reduced by 5.84mw/c over 25c, when mounted on a glass epoxy board (50mm x 58mm x 1.75mm; 8layers) (note 2) must not exceed pd, aso, or tjmax of 150c caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol min typ max unit power supply voltage v cc 2. 3 - 5.5 v control input voltage v in 0 - v cc v h-bridge output current (note 3) i out -0.4 - +0.4 a/ch operating temperature range topr - 25 - +85 c (note 3) must not exceed pd, aso, or tjmax of 150c downloaded from: http:///
4/ 14 bd6 360gul tsz02201-0h3h0b101420-1-2 ? 20 15 rohm co., ltd. all rights reserved. 09.dec.2015 rev.001 www.rohm.com tsz22111 ? 14 ? 001 electrical characteristics (unless otherwise specified v cc =3 .0v , ta=25c) parameter symbol min typ max unit conditions all circuits stand- by current i ccst - 0 5 a v ps =0v circuit current i cc - 1. 1 1.8 ma v ps =3v with no signal & no load control input (in=ps, in1a, in1b, in2a, in2b, sel) high level input voltage v inh 1.5 - v cc v low level input voltage v inl 0 - 0.5 v high level input current i inh 15 30 60 a v in =3v low level input current i inl -1 0 - a v in =0v under voltage locked out (uvlo) uvlo voltage v uvlo 1.6 - 2 .2 v comparator for photo-interrupter input bias current i bipi -3 0 +3 a output low level voltage v lopi 0 - 0.5 v i out =+1 ma output high level voltage v hipi v cc -0.5 - v cc v i out =-1ma threshold voltage v thpi 1.2 1.3 1.4 v lo w to hi gh threshold voltage hysteresis voltage v hyspi 200 300 400 mv hi gh to lo w threshold voltage - v thpi regulator for photo-interrupter on -resistance r onsw - - 10 i out =- 30 ma off current i lsw -1.0 0 - a v bias =0v full-on drive block output on-resistance r on - 1.00 1.25 i out = 400 ma , high & low-side total turn-on time t on - 0.6 2.0 s i out = 400ma turn-off time t off - 0.08 0.5 s i out = 400ma rise time t r 0.1 0.15 1.0 s i out = 400ma fall time t f - 0.03 0.2 s i out = 400ma downloaded from: http:///
5/ 14 bd6 360gul tsz02201-0h3h0b101420-1-2 ? 20 15 rohm co., ltd. all rights reserved. 09.dec.2015 rev.001 www.rohm.com tsz22111 ? 14 ? 001 typical performance curves (reference data) figure 1 . standby current vs supply voltage figure 2 . circuit current vs supply voltage figure 3. low side output voltage vs output current figure 4 . high side output voltage vs output current 0.0 1.0 2.0 3.0 4.0 5.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 power supply voltage : v cc [v] standby current : i ccst [a] top 85c mid 25c low - 25 c operating range (2.3v to 5.5v) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 power supply voltage : v cc [v] circuit current : i cc [ma] top 85c mid 25c low - 25 c operating range (2.3v to 5.5v) 0.0 0.1 0.2 0.3 0.4 0.5 0.0 0.1 0.2 0.3 0.4 0.5 output current : i out [a] output voltage : v outl [v] top 85c mid 25c low - 25 c operating range (0a to 0.4a) -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.0 0.1 0.2 0.3 0.4 0.5 output current : i out [a] output voltage : v outh [v] top -25c mid 25c low 85c operating range (0a to 0.4a) downloaded from: http:///
6/ 14 bd6 360gul tsz02201-0h3h0b101420-1-2 ? 20 15 rohm co., ltd. all rights reserved. 09.dec.2015 rev.001 www.rohm.com tsz22111 ? 14 ? 001 typical performance curves (reference data) - continued figure 5. regulator output voltage vs output current -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0 20 40 60 80 100 output current : i o [ma] output voltage : vbias [v] operating range (0ma to 30ma) top -25c mid 25c low 85c downloaded from: http:///
bd 6360gul 7/ 14 tsz02201-0h3h0b101420-1-2 ? 20 15 rohm co., ltd. all rights reserved. 09.dec.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 timing chart table 1 . i/o truth table input mode input output ps (note 4) sel in1a/2a in1b/2b out1a/2a out1b/2b output mode (note 5) en/in h l l x z z open h l h l cw h h l h ccw in/in h l l z z open h l h l cw l h l h ccw h h l l short brake - l x x x z z open l: low, h: high, x: don t care, z: hi impedance (note 4) ps= high: operation mode, ps=low: stand-by mode (note 5) cw : c urr ent flows from outxa to outxb, ccw: current flows from outxb to outx a (x=1, 2) figure 6. input-output ac characteristic the wave-shaping circuit convert the wave-shaping circuit converts th e distorted output signal of the photo-interrupter into rectan gular wave . the hysteresis function prevents chatter of the output signal b y the noise included in the input signal . this function enables to output the rectangular signal. figure 7 . photo-interrupter i/o timing chart 100% 0% -100% mot or current v in 100% 0% t on ton t off t off t f t r t f t r 50% 50% 50% 50% - 50% - 50% 90% 10% - 10% - 90% - 90% - 10% 10% 90% cin ps cout 1.3v 1.0v h l vcc 0v hi impedance downloaded from: http:///
bd 6360gul 8/ 14 tsz02201-0h3h0b101420-1-2 ? 20 15 rohm co., ltd. all rights reserved. 09.dec.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 application example selection of components externally connected when using the circuit with changes to the external circu it constants, make sure to leave an adequate margin for e xternal components including static and transitional characteristic s as well as dispersion of the ic. bypass filter capacitor for power supply ps vcc 1f to 100f out1a out1b in1a bandgap tsd & uvlo 4d 3d 4b 1d 1c power save level shift & pre driver in1b 2c sel 4c h-bridge full on gnd out2a out2b 1b 1a 2d h-bridge full on 3b 3c level shift & pre driver cout in2a in2b bias cin logic logic vcc vref 3a 2a 4a vcc comparator output for converting to sharp waveform comparator input for converting to sharp waveform regulator for photo-interrupter - + power-saving h: active l: stand- by motor control input motor control input selectable drive mode h : in/in l : en/in downloaded from: http:///
bd 6360gul 9/ 14 tsz02201-0h3h0b101420-1-2 ? 20 15 rohm co., ltd. all rights reserved. 09.dec.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 power dissipation figure 8. power dissipation vs ambient temperature i/o equivalence circuits ps , in1a to in2b, sel out1a to out2b, gnd bias cin cout 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature : ta [c] power dissipation : pd [w] 0.73 w 0.38 w 85c gnd outxa outxb v cc v cc v cc 50 v cc 1k 10k 1k 10k v cc 140k v cc 100k 10k downloaded from: http:///
bd 6360gul 10 / 14 tsz02201-0h3h0b101420-1-2 ? 20 15 rohm co., ltd. all rights reserved. 09.dec.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 op erational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting the a nalog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capac itors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal(gnd) and large-current groun d(pgnd) traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensu re that the ground traces of external components do not caus e variations on the ground voltage. the ground lines must be as sh ort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding thi s absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coup ling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field m ay cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors compl etely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small c harge acquired in this way is enough to produce a significant e ffect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specifie d, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
bd 6360gul 11 / 14 tsz02201-0h3h0b101420-1-2 ? 20 15 rohm co., ltd. all rights reserved. 09.dec.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physica l damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd v oltage to an input pin (and thus to the p substrate) should be avoided. figure 9. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bia s and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceede d for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other than protecting the ic from heat damage. 16. disturbance light in a device where a portion of silicon is exposed to lig ht such as in a wl -csp, ic characteristics may be affected due to photoelectric effect. for this reason, it is recommended to co me up with countermeasures that will prevent the chip from being exposed to light. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
bd 6360gul 12 / 14 tsz02201-0h3h0b101420-1-2 ? 20 15 rohm co., ltd. all rights reserved. 09.dec.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 ordering information b d 6 3 6 0 g u l - e 2 part number package gul: vcsp50l2 packaging and forming specification e2 : reel-wound embossed taping marking diagram part number marking package orderable part number aag vcsp50l2 bd 6360gul- e2 vcsp50l2 (top view) a a g part number marking lot number 1pin mark downloaded from: http:///
bd 6360gul 13 / 14 tsz02201-0h3h0b101420-1-2 ? 20 15 rohm co., ltd. all rights reserved. 09.dec.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name vcsp50l2 (BD6360GUL) direction of feed < tape and reel information > tape quantity direction of feed embossed carrier tape (with dry pack) 3000pcs e2 (the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand.) when you order , please order in times the amount of package quantity. reel 1pin 1234 1234 1234 1234 1234 1234 downloaded from: http:///
bd 6360gul 14 / 14 tsz02201-0h3h0b101420-1-2 ? 20 15 rohm co., ltd. all rights reserved. 09.dec.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 revision history da te revision changes 09.dec.2015 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation depending on ambient temperature. when used in sealed area, c onfirm that it is the use in the range that does not exceed t he maximum junction temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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